RPCrowe wrote in post #18591046
Physically, the CF cards are a lot more robust. I cringe every time I put pressure on the SD card in my 6D2 and hope that the darn flimsy thing doesn't break...
This isn't necessary true these days and for a long time. CF card due to lack of market volume, there hasn't been any advancement in manufacturing process. If you open up a latest high end CF card, you will see flash (BGA or TSOP), controller, plus a few passive component surface mounted on a PCB. Physically, this design isn't very robust. It is prone to environment. The CF package is what protecting the internal components, which isn't very good.
A modern SD or uSD, they are made into what is called a SIP package. Controller and flash are all mold into a fiber glass like substrate, air and water tight. The only thing exposed to environment is the interface pins. From physical stand point, modern SD are a lot more robust. The picture above shows a broken transent card, where you can see PCB, it is a very old manufacturing process. Either transcent doesn't have the mean to do SIP or it is just a very old card.
Now, electrically, CF is a lot more robust. This is due to the high margin and low volume of the CF card. Manufactures are willing to do a lot of screening and testing, even burn in for the internal components. The flash you get in CF today is very high quality, much higher than even those you find in majority of the SSDs.