siriusdogstar wrote in post #9216651
My vote goes for circular sensor; silicon wafers are circular. (ref:
http://en.wikipedia.org/wiki/Silicon_wafer
) Problem now with large high density sensor chip is high reject rate; a large low-density sensor would have low reject rate & larger sensor possibility: an 4" wafer with same density as 300D sensor would blow away results from smaller higher density sensor in terms of usable information! (I want 8" wafer!)
This is a silicon wafer for Canon Full Frame sensors. It is a 7 inch wafer:
You know how much those sensors cost. You want a 4 inch sensor? Full frame sensors are 1.4 by 1 inch. Talk about an expensive camera. And a HUGE one at that. Medium Format is only 2 by 1.5.
Putting one sensor on one wafer would have terrible yields. The benefit of multiple chips on one wafer is that if one part of the wafer is bad, only one sensor goes bad. I know you were just playing, but I'm just sayin.